Brief: Discover the advanced capabilities of our Immersion Gold PCB Assembly for RCC Build-up Material, achieving a 0.2mm 8mil min hole size. Perfect for aerospace and high-tech industries, our PCBs offer precision, durability, and superior performance.
Related Product Features:
Supports 2 to 40 layers for Rigid PCBs and 1 to 10 layers for Rigid-flex PCBs.
Maximum panel size of 21" x 24" for versatile applications.
PCB thickness ranges from 0.016" to 0.120" to meet diverse needs.
Inner layer line & spaces as fine as 0.003" and outer layers at 0.004".
Hole size options include 0.006" thru hole and 0.004" buried via.
Uses high-quality materials like FR4, High Tg, Rogers, and Teflon.
Offers various surface finishes including ENi/IAu, OSP, and Immersion Gold.
Specializes in Blind/Buried Via (HDI 2+N+2) and Rigid Flex PCBs.
Ερωτήσεις:
What files are required for PCB fabrication?
We require Gerber files, BOM (Bill of Materials), and drawings for PCB fabrication.
How do you ensure the quality of your PCB assemblies?
All our products undergo 100% E-testing. PCB assemblies are checked with 100% AOI, ICT, FT, visual inspection, and 100% X-ray for BGA components.
What is the lead time for PCB assembly?
Sample production takes 3-5 working days, batch production 7-10 working days, and PCB assembly 15-20 working days, depending on files and quantity.